HESSE MECHATRONICS BONDJET BJ820 AUTOMATIC FINE WIRE WEDGE BONDER (REF.: G)

Description

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Please ask us for a shipping quote if you are interested in this item since the displayed shipping cost is an indication and is not accurate. We are obliged by Ebay to indicate a flat rate to list on Ebay.com since we are in Canada
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PAYMENT MUST BE RECEIVED WITHIN 3 DAYS OF AUCTION ENDING
HESSE MECHATRONICS BONDJET BJ820
HIGH SPEED FULLY AUTOMATIC FINE WIRE WEDGE BONDER
UNIT IN GREAT CONDITION CONDITION. 30 DAYS WARRANTY.
SEE PICTURES !!!
HESSE MECHATRONICS BONDJET BJ820
FEATURES
;
The
Hesse Mechatronics
Bondjet BJ820
is world‘s leading fully automated fine wire wedge wedge bonder. The BJ820 is ready for all wire bonding challenges on a single platform, using wires and ribbons made of aluminium, copper and gold.
Reach out to Select-Test.com for further assistance.
Typical applications are components in the HF and RF technology, COB, MCM and hybrids, opto and automotive electronics. The BJ820 defines the latest state of technological development compared to the competition and is benchmark for:
Precision :
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High precision touchdown detection without time delay
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Precise bondforce control (static and dynamic)
Flexibility :
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Largest working area: 305 mm x 410 mm (12″ x 16″)
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Can serve two or more smaller bonding stations for efficient handling of smaller products or substrates,
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elimination indexing time and maximization of throughput (with indexers as well as manual loading)
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Universal software interface for indexer control
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Enables intelligent automation of extra large products
Speed :
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Up to 7 wires per second, application-dependent,
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e.g. with parameters25 µm wire, 1 mm loop length, metallized wafer, 127 ms per bond;
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2 mm loop length, 134 ms per bond
Quality :
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Continuous real time monitoring of wire deformation, transducer current, frequency and impedance within programmable control limits
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Piezo bondhead with low maintenance
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Easy connectivity to Hesse Mechatronics` workbench with modules such as process data and backup system PBS200, PiQC, processdatadrain, Secs/Gem or to standard/custom MES (Manufacturing execution systems)
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Process integrated Quality Control (PiQC), detection of other parameters by additional sensors (e.g. friction) for 100% quality monitoring in real time (patented)
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E-Box: patented solution for optimized tool change and programmable alignment marks for wedge and wire clamp
Process Advantages :
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Loop length: 70 µm up to 20 mm (2.8 mil – 800 mil), depending on wire diameter
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Various loop form functionsConstant wire length
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Constant loop height
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Individual loop shapes
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Fine Pitch 40 µm inline, 25 µm staggered/dual line (depending on wire and loop)
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You can use the following dimensions to get an idea of the shipping costs;
PALLET (SKID) SIZE
96 INCHES X 48 INCHES X 76 INCHES
Weight = 1800 lbs APPROX.
Unit to be shipped from Postal Code (equivalent of Zip Code): H1E 5Y8